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1. general description this 14-bit bus switch/multiplexer (mux) is designed for 1.5 v or 1.8 v supply voltage operation, pod_12, sstl_12, sstl_135, sstl_15 or sstl_18 signaling and cmos select input levels. it is designed for operation in ddr2 , ddr3 or ddr4 memory bus systems. the CBTW28DD14 has a 1 : 2 switch or 2 : 1 multiplex topology and offers a 14-bit wide bus. each 14-bit wide a-port can be switched to one of two ports b and c, for all bits simultaneously. the selection of the port is by a simple cmos input (select). another cmos input (enable) is availa ble to allow all ports to be disconnected. each port is non-directional due to the use of fet switch es, allowing a multitude of applications requiring high-bandwidth s witching or multiplexing. the sel and en input signals are designed to operate transparently as cmos input level signals in both 1.5 v and 1.8 v supply voltage conditions. CBTW28DD14 uses nxp proprietary high-speed switch architecture providing high bandwidth, very little insertion loss at lo w frequency, and very low propagation delay, allowing use in many applicat ions requiring switching or multiplexing of high-speed signals. it is available in a 4.5 mm ? 4.5 mm tfbga48 package with 0.5 mm ball pitch, for optimal size versus board layout density cons iderations. it is characterized for operation from ? 10 ? c to +85 ? c. 2. features and benefits 2.1 topology ? 14-bit bus width ? 1 : 2 switch/mux topology ? bidirectional operation ? simple cmos select pin (sel) ? simple cmos enable pin (en) 2.2 performance ? 2.5 ghz bandwidth ? low on insertion loss ? low crosstalk ? high off isolation ? pod_12, sstl_12, sstl_135, sstl_15 or sstl_18 signaling CBTW28DD14 14-bit bus switch/multipl exer for ddr2/ddr3/ddr4 applications rev. 5 ? 28 may 2014 product data sheet
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 2 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications ? low r on (10 ? typical) 2.3 general attributes ? 1.5 v or 1.8 v supply voltage operation ? very low supply current (300 ? a typical) ? esd robustness exceeds 3 kv hbm, 1 kv cdm ? available in tfbga48 package, 4.5 mm ? 4.5 mm ? 0.8 mm size, 0.5 mm pitch, pb-free/dark green 3. applications ? ddr2/ddr3/ddr4 memory bus systems ? systems requiring high-speed multiplexing 4. ordering information 4.1 ordering options 5. functional diagram table 1. ordering information type number topside marking package name description version CBTW28DD14et w2814 tfbga48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 ? 4.5 ? 0.8 mm sot1155-1 table 2. ordering options type number orderable part number package packing method minimum order quantity temperature CBTW28DD14et CBTW28DD14et,118 tfbga48 reel 13? q1/t1 *standard mark smd 4000 t amb = ? 10 ? cto+85 ? c fig 1. functional diagram 002aae969 CBTW28DD14 14-bit 2 : 1 mux/switch v dd sel en b[0:13] c[0:13] a[0:13] gnd host side b host side c dram side
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 3 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration for tfbga48 fig 3. ball mapping 002aae970 CBTW28DD14et transparent top view h g f d b e c a 2468 1357 ball a1 index area b9 1 a b10b b11c c11d b12e b13f a13g a12h b8 2 c9 c10 en c12 c13 a11 a10 b7 3 c8 a9 a8 c7 4 gnd gnd a7 c6 5 v dd v dd a6 b6 6 c5 a4 a5 b5 7 c4 c3 sel c1 c0 a2 a3 b4 8 b3 b2 c2 b1 b0 a0 a1 002aae971 transparent top view table 3. pin description symbol pin type description a[0:13] g8, h8, g7, h7, g6, h6, h5, h4, h3, g3, h2, g2, h1, g1 high-speed i/o 14-bit wide input/output, port a b[0:13] f8, e8, c8, b8, a8, a7, a6, a3, a2, a1, b1, c1, e1, f1 high-speed i/o 14-bit wide input/output, port b c[0:13] f7, e7, d8, c7, b7, b6, a5, a4, b3, b2, c2, d1, e2, f2 high-speed i/o 14-bit wide input/output, port c sel d7 cmos input cmos input signal. when sel = low, port a and port b are mutually connected. when sel = high, port a and port c are mutually connected. en d2 cmos input cmos input signal. when low, all ports are mutually isolated. when high, connection is set using the sel input signal. v dd b5, g5 supply supply voltage connection gnd b4, g4 ground ground connection
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 4 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 7. functional description refer to figure 1 ? functional diagram ? . the CBTW28DD14 uses a 1.5 v or 1.8 v power supply. all signal paths are implemented using high-bandwidth pass-gate technology and are non-directional. no clock or reset signal is needed for the multiplexer to func tion. the switch position for the channels is selected using the select signal sel. the detailed operation is described in section 7.1 . 7.1 function selection the internal multiplexer switch position is controlled by two logic inputs, sel and en, as described in table 4 . when a channel is not being used, port b and port c of this channel should be tied to ground. for example, if channel 2 is not used, b2 and c2 should be tied to ground and a2 should be left open. 8. limiting values [1] human body model: ansi/eos/esd-s5.1-1994, standard for esd sensitivity testing. human body model - component level; electrostatic disc harge association, rome, ny, usa. [2] charged-device model: ansi/eos/esd-s5.3-1- 1999, standard for esd sensitivity testing, charged-device model - component level; electr ostatic discharge association, rome, ny, usa. table 4. function selection x = don?t care. inputs switch position en sel a ? b a ? c low x off (isolating) off (isolating) high low on (conducting) off (isolating) high high off (isolating) on (conducting) table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage ? 0.3 +2.5 v t case case temperature for operation within specification ? 40 +85 ?c v esd electrostatic discharge voltage hbm [1] - 3000 v cdm [2] - 1000 v
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 5 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 9. recommended operating conditions 10. static characteristics [1] typical values are at v dd = 1.8 v, t amb =25 ? c, and maximum loading. 11. dynamic characteristics table 6. operating conditions symbol parameter conditions min typ max unit v dd supply voltage 1.4 1.5 or 1.8 2.0 v v i input voltage all inputs ? 0.3 - v dd +0.3 v t amb ambient temperature operating in free air ? 10 - +85 ?c table 7. static characteristics v dd = 1.4 v to 2.0 v; t amb = ? 10 ? c to +85 ? c; unless otherwise specified. symbol parameter conditions min typ [1] max unit i dd supply current en = high; v dd =1.8v - 0.3 1 ma en = low; v dd =1.8v --10 ? a i ih high-level input current v dd =2.0v; v i =v dd --? 5 ? a i il low-level input current v dd =2.0v; v i =gnd - - ? 5 ? a v ih high-level input voltage sel, en pins 0.8v dd --v v il low-level input voltage s el, en pins -0.5 - 0.2v dd v v ik input clamping voltage v dd =2.0v; i i = ? 18 ma - ? 0.7 ? 1.2 v table 8. dynamic characteristics symbol parameter conditions min typ max unit t startup start-up time supply voltage valid or en going high to channel specified operat ing characteristics --1 ms t rcfg reconfiguration time sel state change to channel specified operating characteristics --1 ? s v i input voltage ? 0.3 - v dd +0.3 v v bias(dc) bias voltage (dc) 0 - 2.0 v ? il insertion loss channel is on; 0 hz ? f ? 1.0 ghz ? 2.5 ? 1.5 - db channel is on; f = 2.5 ghz ? 4.5 - - db channel is off; 0 hz ? f ? 3.0 ghz - - ? 20 db rl in input return loss channel is on; 0 hz ? f ? 1.0 ghz - - ? 10 db ? ct crosstalk attenuation adjacent channels are on; 0hz ? f ? 1.0 ghz --? 25 db b bandwidth ? 3.0 db intercept - 2.5 - ghz t pd propagation delay from a port to b port or c port or vice versa - 80 - ps t sk skew time from any output to any output - - 20 ps
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 6 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 12. package outline fig 4. package outline tfbga48 (sot1155-1) 5hihuhqfhv 2xwolqh yhuvlrq (xurshdq surmhfwlrq ,vvxhgdwh ,(& -('(& -(,7$ 627 vrwbsr 8qlw pp pd[ qrp plq $ 'lphqvlrqv 7)%*$sodvwlfwklqilqhslwfkedoojulgduud\sdfndjhed ooverg\[[pp 627 $ $ e'(hh h yz \\ p p vfdoh edoo$ lqgh[duhd % $ ' ( $ % & ' ( ) + * e h h h h h h $& % y & z edoo$ lqgh[duhd & \ & \ ; ghwdlo; $ $ $
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 7 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 13. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 8 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 13.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 5 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 9 and 10 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 5 . table 9. snpb eutectic process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 10. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 9 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14. abbreviations msl: moisture sensitivity level fig 5. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 11. abbreviations acronym description cdm charged-device model cmos complementary metal-oxide semiconductor ddr2 double data rate 2 ddr3 double data rate 3 ddr4 double data rate 4 dram dynamic random access memory esd electrostatic discharge fet field-effect transistor hbm human body model i/o input/output mt/s mega transfers per second pod_12 1.2 v pseudo open drain interface sstl_12 stub series terminated logic for 1.2 v sstl_135 stub series terminated logic for 1.35 v sstl_15 stub series terminated logic for 1.5 v sstl_18 stub series terminated logic for 1.8 v
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 10 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 15. revision history table 12. revision history document id release date data sheet status change notice supersedes CBTW28DD14 v.5 20140528 product data sheet - CBTW28DD14 v.4 modifications: ? table 8 ? dynamic characteristics ? : ? changed t rcfg max from 1 ms to 1 ? s. CBTW28DD14 v.4 20130812 product data sheet - CBTW28DD14 v.3 CBTW28DD14 v.3 20130805 product data sheet - CBTW28DD14 v.2 CBTW28DD14 v.2 20120726 product data sheet - CBTW28DD14 v.1 CBTW28DD14 v.1 20100720 product data sheet - -
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 11 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
CBTW28DD14 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights reserved. product data sheet rev. 5 ? 28 may 2014 12 of 13 nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors CBTW28DD14 14-bit bus switch/multiplexer for ddr2/ddr3/ddr4 applications ? nxp semiconductors n.v. 2014. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 28 may 2014 document identifier: CBTW28DD14 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.3 general attributes . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 function selection. . . . . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 soldering of smd packages . . . . . . . . . . . . . . . 7 13.1 introduction to soldering . . . . . . . . . . . . . . . . . . 7 13.2 wave and reflow soldering . . . . . . . . . . . . . . . . 7 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7 13.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 17 contact information. . . . . . . . . . . . . . . . . . . . . 12 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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